Tuesday, 23 July, 2024

Automotive Tubing Heat Shrink Furnace


https://www.gdlbtech.com/Automotive-Tubing-Heat-Shrink-Furnace.html

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Automotive Tubing Heat Shrink Furnace

The system is mainly used for flexible substrate Polyimide curing process.

PI Oven

Application and General Requirement

The system is mainly used for flexible substrate Polyimide curing process. This system is required to be reasonable in design, with advanced technology to ensure the system an excellent kinetic performance. The action elements selected for the control system shall be of high accuracy, good reliability and rapid response. The machine shall be convenient for use, operation and maintenance, be artistic in configuration, compact in structure, stable in performance and satisfactory in after-sale service.

Requirements, main specifications and parameters of the Equipment

The design and manufacturing of this machine shall be in compliance with related standards.

International unit standards (SI) should be adopted for the denominations of all elements, parts and various instruments of this equipment.

Application and General Requirement:

The system is mainly used for flexible substrate Polyimide curing process in flexible OLED process

Specification:No mura caused by PI oven process be found after lighting on(Module).

There must be no mura caused by M/C.

The mura, which include two types:

1. It could found by eyes or mura inspection equipment ,

2. It could cause pattern displaying abnormal.

Especially Pin mura can't be found.

Especially bubble mura can't be found.

Inspection condition:

Glass:all types of mass process glass

Inspection equipment:macro scope Inspection equipment (mac/mic) & inline macro.

Warpage

Specification:≤300um(glass with dry film,10um(vender: Kaneka, UBE, Toray)

Particle

Cleanliness class of internal chamber.

Spec:BOE class 10: ≥ 0.3um/ft3 10ea;≥0.5um/ft3 3ea;≥1 um/ft3 1ea (refer to BOECD common spec,no glass condition)

Temperature specification

BOE standard recipe specification:

Within glass : temp profile: 120℃->180℃->350℃->500℃->120℃Max Temp:550℃Ramp up ≤±5℃Cool down≤±25℃Dwell≤±2℃

Glass to glass (point to point) : temp profile: 120℃->180℃->350℃->500℃->120℃Max Temp:550℃Ramp up ≤±5℃Cool down≤±30℃Dwell≤±3℃

Chamber to chamber (point to point) :temp profile: 120℃->180℃->350℃->500℃->120℃Max Temp:550℃Ramp up ≤±5℃Cool down≤±30℃Dwell≤±3℃

Chamber temperature should be display on the main PC


Vivi
lbt@lbt.tw

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